Electronic Encapsulation

Silicon powder and LTCC glass powder are commonly used raw materials in the modern electronic packaging industry. With its excellent performance in acid and alkali corrosion resistance, wear resistance, high insulation, high thermal conductivity, high thermal stability, low expansion coefficient, and low dielectric coefficient, it is widely used in the copper clad laminate industry. With the improvement of surface treatment conditions, their compatibility with resin systems has been improved. Therefore, silicon micropowder and LTCC glass powder are used as fillers to be applied to copper clad laminates, which not only reduces costs but also improves certain properties of copper clad laminates. Such as thermal expansion coefficient, bending strength, dimensional stability, etc., it is a functional filler.

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We can provide processes and equipment that meet the following performance indicators

Ball mill with air classifier machine processing technology

This process is mature and reliable and is widely used in the production of silicon powder. There are many production lines in the world.


200~1250 mesh mid-grade silicon powder, generally uses the ball mill with air classifiers. Single-line production capacity is 2t/h to 20t/h. This process is mature and reliable, and there are many production lines in China, including Anhui Fengyang, Anqing, Henan , Heyuan, Qingyuan, Foshan, Jiangxi, Tangshan, Linyi, and others. It mainly produces 200-400 mesh pieces. Based on this product, a small amount of 600-1000 mesh products with less stringent requirements are also produced.

The performance of the ball mill is affected by factors such as feed fineness, effective diameter, length-diameter ratio, rotation speed of the ball mill, selection and grading of the ball mill medium, loading amount, effective length of the grinding body, the size of the feeding amount, and other conditions. The output of the classifier is influenced by factors such as powder concentration, turbine classifier speed, air volume and pressure, classification efficiency, particle size distribution, product fineness, and other conditions.


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